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Brand Name : OHMALLOY
Model Number : C19400
Certification : SGS
Place of Origin : China
MOQ : 20kg
Price : 30USD/KG
Supply Ability : 50T/Monthes
Packaging Details : woodencase
Type : Strip
Thickness : 0.2
Application : Industry
Material : Copper / Copper Alloy
Shape : wire
Resistance (μω.m) : Stable
Welding current : International Standard
0.2mm thick C19400 foil for semiconductor chip lead frame
The remarkable characteristics of the material are: high strength, high conductivity, high precision and high softening temperature resistance, as well as suitable processing properties and electroplating brazing properties.
It is mainly used for the production of semiconductor chip lead frame, integrated circuit and electronic discrete devices, electronic industry connectors, etc.
Standard:
GB/T | DIN | EN | ASTM | JIS |
QFe2.5 | CuFe2P 2.1310 | CuFe2P CW107C | C19400 | C19400 |
Chemical composition:
Cu | Bal. |
Fe | 2.1-2.6 |
Zn | 0.05-0.2 |
P | 0.015-0.15 |
Physical property:
Density(g/cm3) | 8.9 |
Conductivity IACS% {(20℃)} | 60min |
Modulus of elasticity(KN/mm2) | 121 |
Thermal conductivity {W/(m*K)} | 280 |
Coefficient of thermal expansion (10-6/℃ 20/℃ ~100/℃) | 17.7 |
Status | Tensile strength | Yield strength | Elongation A50 | Hardness | Bending test | |
90°(R/T) | ||||||
(Rm,MPa) | (Rp0.2,MPa) | (%) | (HV) | GW | BW | |
R300 | 300-340 | 240max | 20min | 80-100 | 0 | 0 |
R340 | 340-390 | 240min | 10min | 100-120 | 0 | 0 |
R370 | 370-430 | 330min | 6min | 120-140 | 0 | 0 |
R420 | 420-480 | 380min | 3min | 130-150 | 0.5 | 0.5 |
R470 | 470-530 | 440min | 4min | 140-160 | 0.5 | 0.5 |
R530 | 530-570 | 470min | 5min | 150-170 | 1 | 1 |
Package
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0.2mm C19400 Copper Based Alloy Foil For Semiconductor Chip Lead Frame Images |